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Substrate Engineer
 Cisco Systems, Inc. | |
 United States, Arizona, Phoenix | |
 February 04, 2023 | |
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What You'll Do The Silicon One Productization team pioneers manufacturing and test solutions to accelerate time-to-market and enable outstanding supply chain metrics. We are looking for a Principal Engineer, Advanced Packaging to envision efficient package design and technology solutions and lead the team to deliver manufacturable and reliable recipes to volume manufacturing. The Advanced Packaging team is responsible for defining the product-technology intercepts, crafting test vehicle, roadmaps and selecting and enabling the supply chain to meet cost, quality and delivery metrics. In this role you will: Develop the technical requirements for design enablement of the packaging technologies via Design for Manufacturing (DfM) and Design for Reliability (DfR) checks and develop the associated processes technologies. Identify and down select materials. Partner with multiple various dedicated Cisco teams as well as substrate vendors and OSATs to evaluate and align technology and product intercepts for current generation and future generation of products. Steward test vehicle enveloping the products in the roadmap to enable new technologies, features, and large body size packages. Establish closed-loop learning to investigate failure modes impacting yields, quality and reliability. Establish metrics for manufacturability and quality management for advanced packages. Develop a world-class advanced packaging team. Partner with customer supply chains to enable next level integration. Who You'll Work With You will with partner with ASIC Engineering, HW Engineering and Customer supply chains to deliver efficient solution for electrical, thermal, and mechanical performance. You will work with other functions within the Silicon One supply chain to support sourcing, test, and qualification activities. Our Minimum Requirements for This Role Through industry knowledge of various semiconductor packaging technologies and knowledge of the packaging industry. 10-12 years of experience in working across multiple areas of packaging, including good grip in the field of modeling, design, materials characterization, and qualification. Good understanding of packaging-based Design Rules (DR), packaging architecture and its impact to final product performance, yield and cost. Proven track record of supporting New Product Introduction (NPI) and introduction of new technologies. Any direct involvement or ownership from the evaluation of new technologies till its introduction to high volume manufacturing is a plus. Knowledge across wide range of assembly technologies, packaging, process technologies, including fan-out, wafer level packaging, SMT, Die attach. Any hands-on experience of the process technologies or exposure to vendor manufacturing facilities is a plus. Experience in utilizing program management methodologies to plan, execute and monitor various process and product development projects. Ability to provide various structured problem-solving technics, statistical technics, quality management technics, process control, DOE, SPC. Ability to draw conclusions, set trend from complex data using statistical tools, and drive continuous improvements across multiple areas using data driven approach. Ability to thrive in a multifaceted environment with self-initiation and motivation to reach out to deliver the solutions. Educational Qualifications: MSE (or higher) in Materials, Metallurgical, Mechanical, Industrial or Chemical Engineering. Learn more about Cisco's Silicon One Product line here: Why Cisco #WeAreCisco. We are all unique, but collectively we bring our talents to work as a team, to develop innovative technology and power a more inclusive, digital future for everyone. How do we do it? Well, for starters - with people like you! Nearly every internet connection around the world touches Cisco. We're the Internet's optimists. Our technology makes sure the data travelling at light speed across connections does so securely, yet it's not what we make but what we make happen which marks us out. We're helping those who work in the health service to connect with patients and each other; schools, colleges and universities to teach in even the most challenging of times. We're helping businesses of all shapes and size to connect with their employees and customers in new ways, providing people with access to the digital skills they need and connecting the most remote parts of the world - whether through 5G, or otherwise. We tackle whatever challenges come our way. We have each other's backs, we recognize our accomplishments, and we grow together. We celebrate and support one another - from big and small things in life to big career moments. And giving back is in our DNA (we get 10 days off each year to do just that). We know that powering an inclusive future starts with us. Because without diversity and a dedication to equality, there is no moving forward. Our 30 Inclusive Communities, that bring people together around commonalities or passions, are leading the way. Together we're committed to learning, listening, caring for our communities, whilst supporting the most vulnerable with a collective effort to make this world a better place either with technology, or through our actions. So, you have colorful hair? Don't care. Tattoos? Show off your ink. Like polka dots? That's cool. Pop culture geek? Many of us are. Passion for technology and world changing? Be you, with us! #WeAreCisco#CiscoSiliconOne #SiOps #LI-TW3 #supplychainstrong | |