IC Package Development Manager, Signal and Power Integrity

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Responsible for managing the team that is involved in package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.

• Interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.

• Collaborate with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

What We're Looking For

• Bachelor's degree in computer science, Electrical Engineering or related fields and 10-15 years of related professional experience. OR Master's degree and/or PhD in Computer Science, Electrical Engineering, or related fields with 8-10 years of experience.

• Strong fundamentals in EM, transmission lines and microwave theory

• Experience in managing high performance technical teams.

• Familiarity of using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity

• Experience with 2.5D/3D package development is highly desired.

• Proven track record of new product introduction from concept, through development and production

• Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.

• Capability to do resource management for the package development life cycle

• Understanding of IC package layout tools like APD or PADS

• Drive automation of SI, PI and Packaging activities using scripting tools like Python

• Manage engineers doing VNA and TDR measurements for package and PCB characterization.

• Understanding of power plane design, modeling and analysis using tools like PowerSI, SIwave

• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules

• Knowledge of the thermal and mechanical analysis of the IC package development is a plus.

• Experience with channel simulations using MATLAB or ADS or other tools is a plus.

• Strong communication, presentation, and documentation skills

• Ability to look after the well being of the team to ensure that team is performing efficiently.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.