Process Development Engineer, SiPho/Packaging/3D-HI

Looking for a career path in the high tech manufacturing industry? Become part of a team focused on delivering the most exciting semiconductor technology to the world! If you enjoy working with others in a fast pace environment and are looking for an opportunity to grow your career in the high tech industry then Tower Semiconductor is the place to be!

Tower Semiconductor is a global specialty foundry leader! We specialize in manufacturing analog integrated circuits for more than 300 customers worldwide in growing markets such as automotive, medical, industrial, consumer and aerospace and defense, among others.

Responsible for process development of specific modules and new capabilities for silicon photonics:development, prototypes and initial production.

• Help drive technology prototypes and process release to production.
• Interact with vendors, fabs, designers and customers
• Hands-on test structure creation, layout, design for tape-out
• Hands-on knowledge of tools, fab processing and technology qualification, including test structure methodology, reliability and yield improvement
• Personal experience in semiconductor fabrication module development, process development, packaging, and process qualification.
• Modules will be developed for advanced packaging, 3D-HI, and for electro-optical circuits.
• May include customer and vendor-partner interactions as well as simulation and modeling
• Some travel expected
• Focus is foundry -- through technology delivery and fab and customer enablement

• Get excited about creating new devices and process modules
• Understand & enjoy key physical principles of materials and electrical / electro-optical components
• Execute the creation of .gds for masks, including test structure requirements for R&D and product qualification
• Work in a fast paced, multidisciplinary environment focused on technology delivery
• Have experience in volume Semiconductor fab manufacturing
• Enjoy working with diverse people and solving problems as part of a team or individually
  
  

• Specific skills: .gds layout (e.g. Cadence Virtuoso software, others).
• Demonstrated knack for project management and people skills.
• Strong understanding of semiconductor processing and integration.
• Minimum 5-10 years of experience in related semiconductor roles. MS or PhD degree in Materials, Electrical Engineering or other relevant field related to process module development, 3D-HI & packaging, Si Photonics, and Semiconductor development & manufacturing.
• Have personally fabricated device structures from design through fab and electrical test at any point in career. Electrical, optical or passive devices.

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Compensation:
$120,000 - $198,000