Silicon Photonics Packaging Technical Leader (HYBRID) 2000935

• Serve as the primary technical interface with Outsourced Semiconductor Assembly & Test (OSAT) and key component partners, driving assembly, test, and qualification for silicon photonics packages.
• Proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain.
• Work collaboratively with design teams to influence package architecture and provide expert guidance on DfM, DfR contributing to the definition of critical process parameters for HVM. Engage deeply in substrate & PCB design, materials selection, and reviews.
• Collaborate closely with internal and external teams to optimize packaging solutions for performance, cost, and manufacturability.
• Present technical findings and recommendations to cross-functional teams and stakeholders
• Stay informed on emerging packaging technologies and industry trends, contributing to the evaluation of new materials, processes, and architectures.
• Mentor and guide junior engineers, fostering technical excellence and innovation within the team.

• MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field, in combination with 7+ years of progressive experience in Photonics or Semiconductor Packaging Industry
• Proven experience in advanced package assembly and integration and package reliability qualification
• Understanding of package design & architecture, including substrate design and fabrication.
• Expertise in advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis skills.
• Knowledge and experience in physical failure analysis

• Experience in Silicon Photonic packaging and/or co-packaged optics is a plus
• Familiarity with volume manufacturing
• Exceptional ability to work within and lead projects with highly cross-functional and geographically distributed technical teams.
• Strong communication, data presentation, and influencing skills, capable of articulating technical concepts clearly to diverse audiences
• Willingness to learn and evolve professionally
• Experience with Advanced Packaging technologies such as 2.5D/3D, TSV, flip-chip, stacking, hybrid integration.

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Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.

U.S. employees are offered benefits, subject to Cisco's plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance. Please see the Cisco careers site to discover more benefits and perks. Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.

U.S. employees are eligible for paid time away as described below, subject to Cisco's policies:

• 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees

• 1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco

• Non-exempt employees** receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees

• Exempt employees participate in Cisco's flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)

• 80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours ofunused sick timecarried forwardfrom one calendar yearto the next

• Additional paid time away may be requested to deal with critical or emergency issues for family members

• Optional 10 paid days per full calendar year to volunteer

For non-sales roles, employees are also eligible to earn annual bonuses subject to Cisco's policies.

Employees on sales plans earn performance-based incentive pay on top of their base salary, which is split between quota and non-quota components, subject to the applicable Cisco plan. For quota-based incentive pay, Cisco typically pays as follows:

• .75% of incentive target for each 1% of revenue attainment up to 50% of quota;

• 1.5% of incentive target for each 1% of attainment between 50% and 75%;

• 1% of incentive target for each 1% of attainment between 75% and 100%; and

• Once performance exceeds 100% attainment, incentive rates are at or above 1% for each 1% of attainment with no cap on incentive compensation.

For non-quota-based sales performance elements such as strategic sales objectives, Cisco may pay 0% up to 125% of target. Cisco sales plans do not have a minimum threshold of performance for sales incentive compensation to be paid.

The applicable full salary ranges for this position, by specific state, are listed below:

New York City Metro Area:

Non-Metro New York state & Washington state:

* For quota-based sales roles on Cisco's sales plan, the ranges provided in this posting include base pay and sales target incentive compensation combined.

** Employees in Illinois, whether exempt or non-exempt, will participate in a unique time off program to meet local requirements.