Photonics Hybrid Integration Engineer

Are you passionate about pushing the boundaries of Silicon Photonics package design? We're seeking a talented and driven Photonics Hybrid Integration Engineer to lead the development of next-generation Silicon Photonics solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize the hybrid/heterogeneous integration of exotic materials into a Silicon Photonics platform and ensure seamless transition to mass production. If you're eager to own the design and development of hybrid/heterogeneous integration and W2W/D2W bonding, while staying abreast of cutting-edge technologies, we encourage you to apply!

As a Photonics Hybrid Integration Engineer, you will be a key technical leader driving the development, optimization, and scaling of fabrication processes for an advanced heterogeneously integrated silicon-photonics platform. You will take ownership of advanced process node development, lead root-cause investigations, guide continuous improvement, and work cross-functionally to enable reliable high-volume manufacturing. Your responsibilities will include (but not limited to):

• Explore, define, and optimize next-generation wafer- and package-level fabrication processes for a high-performance Silicon photonics platforms, including hybrid/heterogeneous integration of exotic materials, using advanced packaging technologies.
• Lead the next generation hybrid silicon photonic design in collaboration with cross-functional teams, stakeholders and vendors to ensure package and performance requirements are met.
• Survey advanced Photonic solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Conduct root cause analysis and implement solutions to achieve high yield targets.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Skills and experience to have

• 3-5 years of experience in integrated photonics, semiconductors, or microelectronics fabrication.
• Expertise in Silicon photonics, TFLN, BTO, etc...
• Experience with wafer fab manufacturing processes, such as lithography, PVD/CVD/ALD, wet/dry etch, CMP.
• Experience with W2W and D2W bonding.
• Track record in developing and optimizing new nanofabrication processes.
• Strong problem-solving skills and ability to analyze complex data sets.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging, AFM, RI characterization.

It would be nice if you also had

• Expertise with advanced packaging (3D, 2.5D) technologies.
• Experience with RF/high-speed electronics and signal integrity
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Familiar with flip chip, BGA, PCBA, Flex design reliability and processing.
• Experience interfacing with wafer fabs and OSATs