Please Note: To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period. Advancing the World's Technology Together Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more. Here, you'll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what's possible and powering the future. We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicated to empowering people to be their true selves. Together, we're building a better tomorrow for our employees, customers, partners, and communities. What You'll Do
As a Senior Advanced Package Technologist, you will serve as the primary technical bridge between our strategic customers and our internal engineering teams. Rather than focusing on hands-on process development, you will lead technical strategy to define the future of Datacenter SoC packaging. You will be responsible for interpreting complex customer requirements, driving the technical roadmap for advanced packaging (2.5D/3D) and Chiplet architectures, and ensuring that our solutions align with the performance demands of next-generation AI and HPC infrastructure. Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy. Reports to: Head of Custom SoC Solutions Team Req: 42813
- Lead Customer Technical Engagement:Serve as the technical authority in meetings with Tier-1 datacenter customers; address requirements for interconnect bandwidth, power efficiency, and thermal management.
- Translate Requirements to Execution:Deconstruct high-level customer product visions into actionable engineering specifications. Define technical requirements for HBM integration, fine-pitch micro-bumps, and advanced substrate technologies for internal development teams.
- Drive Technology Roadmaps:Evaluate and influence the long-term Advanced Packaging roadmap. Assess the feasibility of emerging technologies-including Hybrid Bonding, Co-Packaged Optics (CPO), and Optical I/O-specifically for the Datacenter SoC market.
- Strategic Project Leadership:Lead the technical lifecycle of packaging projects by identifying bottlenecks, proposing performance-cost trade-offs, and ensuring cross-functional alignment.
- Collaborative Architecture Review:Partner with SoC Architects, Signal/Power Integrity (SI/PI) teams, and Foundry/OSAT partners to ensure package designs support high-speed data transmission and high-power delivery.
- Complete other responsibilities as assigned.
What You Bring
- Educational Foundation:Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field with 10+ years of experience; or a Master's Degree with 8+ years; or a PhD with 5+ years of industry experience.
- Industry Expertise:7+ years of experience in semiconductor packaging, specifically within the Datacenter or HPC ecosystem.
- Advanced Packaging Knowledge:Deep architectural understanding of 2.5D/3D integration, Chiplets, HBM, and TSV technologies, including the challenges inherent in large-die, multi-chip modules.
- Strategic Technical Influence:Proven experience in a technical marketing, applications engineering, or architectural role where you have influenced product roadmaps and managed high-stakes technical relationships.
- Operational Awareness:Ability to balance cutting-edge technical possibilities with business realities such as time-to-market, yield optimization, and supply chain constraints.
- Communication: Exceptional verbal and written communication skills, with the ability to distill complex technical concepts for both executive and engineering audiences.
- You're inclusive, adapting your style to the situation and diverse global norms of our people.
- An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
- You're collaborative, building relationships, humbly offering support and openly welcoming approaches.
- Innovative and creative, you proactively explore new ideas and adapt quickly to change.
#LI-MD1
What We Offer
The pay range below is for all roles at this level across all US locations and functions. Individual pay rates depend on a number of factors-including the role's function and location, as well as the individual's knowledge, skills, experience, education, and training. We also offer incentive opportunities that reward employees based on individual and company performance.
This is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones. In addition to the usual Medical/Dental/Vision/401k, our inclusive rewards plan empowers our people to care for their whole selves. An investment in your future is an investment in ours. Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.
Enjoy Time Away You'll start with 4+ weeks of paid time off a year, plus holidays and sick leave, to rest and recharge.
Care for Family Whatever family means to you, we want to support you along the way-including a stipend for fertility care or adoption, medical travel support, and virtual vet care for your fur babies.
Prioritize Emotional Wellness With on-demand apps and free confidential therapy sessions, you'll have support no matter where you are.
Stay Fit Eating well and being active are important parts of a healthy life. Our onsite Cafe and gym, plus virtual classes, make it easier.
Embrace Flexibility Benefits are best when you have the space to use them. That's why we facilitate a flexible environment so you can find the right balance for you. Base Pay Range
$163,000
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$253,000 USD Equal Opportunity Employment Policy Samsung Semiconductor takes pride in being an equal opportunity workplace dedicated to fostering an environment where all individuals feel valued and empowered to excel, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status. When selecting team members, we prioritize talent and qualities such as humility, kindness, and dedication. We extend comprehensive accommodations throughout our recruiting processes for candidates with disabilities, long-term conditions, neurodivergent individuals, or those requiring pregnancy-related support. All candidates scheduled for an interview will receive guidance on requesting accommodations. Recruiting Agency Policy We do not accept unsolicited resumes. Only authorized recruitment agencies that have a current and valid agreement with Samsung Semiconductor, Inc. are permitted to submit resumes for any job openings. Applicant AI Use Policy At Samsung Semiconductor, we support innovation and technology. However, to ensure a fair and authentic assessment, we prohibit the use of generative AI tools to misrepresent a candidate's true skills and qualifications. Permitted uses are limited to basic preparation, grammar, and research, but all submitted content and interview responses must reflect the candidate's genuine abilities and experience. Violation of this policy may result in immediate disqualification from the hiring process. Applicant Privacy Policy
https://semiconductor.samsung.com/about-us/careers/us/privacy/ |
Samsung Semiconductor Inc.
$163,000-$253,000
paid time off, sick time, 401(k)
Jan 27, 2026