Executive Director of R&D Engineering for 3DIC-Advance Packaging

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a seasoned semiconductor leader with deepexpertisein IC design and advanced packaging, including 3DIC technologies. You have successfully led complex, crossfunctional organizations and delivered differentiated silicon IP solutions from concept to execution.

You bring a strong strategic mindset, combining technical depth with a clear understanding of market dynamics and customer needs. You are known for translating complex technical challenges into actionable plans and for influencing across engineering, product, gotomarket, and customerfacing teams in a highly matrixed, global environment.

You inspire, develop, and empower highperforming teams. You foster a culture of collaboration, accountability, and continuous improvement, and you lead with credibility, clarity, and purpose to consistently exceed business and customer expectations.

WhatYou'llBe Doing:

• Leading 3DIC silicon IP and advanced packaging design and verification across layout, physical design, signal integrity, power integrity, thermal modelling management, and mechanical integrity for AI infrastructure and highperformance computing products.
• Managing cross-functional collaboration with EDA tool development, Go-To-Market strategies, and Customer Success in utilizing Synopsys solutions.
• Keeping track of industry trends in the fast-changing field of 3DIC and semiconductor packaging to drive new product innovations.
• Ensuring developed solutions are in alignment with business objectives while delivering differentiated technical solutions.
• Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.

• Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.

The Impact You Will Have:

• Driving the strategic technology development, planning, and execution of SiliconIP for 3DIC and advanced packaging solutions.
• Influencing and shaping the direction of Synopsys' product offerings in the semiconductor industry.
• Playing a key role in advancing Synopsys' 3DIC and advanced packaging leadership by contributing to the company's long term technology roadmap.
• Enhancing customer satisfaction by delivering state-of-the-art solutions that meet their needs.
• Contributing to the overall success and growth of Synopsys by leading high-impact projects.
• Fostering a culture of excellence and continuous improvement within your team.

WhatYou'llNeed:

? B.S./M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience.

• 15+ years of experience in the semiconductor industry, with demonstrated depth inadvanced packaging and 3DIC technologies.

• Deephands onand organizationalexpertisein3DIC architectures, including chiplets, heterogeneous integration, and die to dieinterconnects.
• Strong command of3DIC specific design and signoff challenges,including signal and power integrity, thermal behavior, mechanical stress, reliability, and yield.
• Experience building, leading, and scaling large, multi site engineering teams, delivering complex 3DIC technologies from architecture through production.
• Ability to driveend to endsilicon IP execution, making sound tradeoffs across performance, power, area, cost, and manufacturability.
• Capability todefine technical vision andlong termroadmapfor 3DIC and advanced packaging, aligned with business strategy.
• Effectiveness ininfluencing across functions, partnering with EDA, product management,go to market, manufacturing, and customer success teams in a matrixed environment.
• Strongcustomer facingleadership, includingdirect engagement with leading customers and ecosystem partnersto shape requirements and drive adoption.
• Acustomer centricmindset, strong execution discipline, and commitment to innovation and continuous improvement.